BGA solder paste is a mechanical mixture of solder powder, flux, binder, and some other components.. Amaoe BGA solder paste differs from ordinary solder wire in its paste form. Amaoe BGA solder paste is convenient to use for soldering (reballing) BGA chips combined with BGA stencils to form perfect balls on BGA chip legs. For precise positioning of the BGA board, we recommend using a platform holder and a magnetic holder. The best option for working with paste is to use hot air soldering stations with a hair dryer.. BGA paste is recommended to be used in well ventilated areas.
1.M9 - Lead Free Silver High Temperature Solder Paste 217°:
Usage Tips: suitable for the master's high maintenance requirements, shorten the repair, but due to the high temperature, it will be more difficult to maintain.
Peculiarities: 217 ° high temperature, containing silver ingredients, fine and sticky, no bubbles of tin landings, even tin beads, hard welding, environmental protection.
2. M10 - Lead Solder Paste 183°:
Usage Tips: suitable for regular maintenance of mobile phones, reduce repairs.
Peculiarities: average temperature 183 °, fine viscosity, no bubbles for planting tin, even tin beads.
3. M11 - Lead Free Low Temperature Solder Paste 138°:
Usage Tips: suitable for servicing mobile phones that cannot withstand high temperatures (such as planting tin in the middle maintenance layer of the iPhone X motherboard), to reduce maintenance complexity and risk.
Peculiarities: low temperature 138 °, fine viscosity, no bubbles for planting tin, uniform tin bead, reduced maintenance complexity, reduced risk, but welding resistance is not as good as moderate and high temperature.
4. M13 - Solder paste containing silver and lead 190°:
Usage Tips: suitable for regular maintenance of mobile phones, reduce repairs.
Specifications: average temperature 190 ° C, silver content, better hardness, electrical conductivity, luster, fine toughness, no tin bubbles, even tin beads.
