LGA170 Bending Corrector Buckle Professional CPU Bending Corrector Frame with Thermal Paste for

Feature: 1. Professional Design: Fixed corrector specially developed for intel 12th and 13th generation CPU bending. All aluminum alloy anodized process, CNC manufactured anodized sandblasted, perfect to avoid capacitance, giving you great mounting experience. 2. Thermal Conductive Paste: Specially customized thermal paste is the ideal CPU thermal paste with high thermal conductivity (6.5Wm K), low thermal resistance, metal free, non‑bleeding and easy to apply. 3. Supported Specification: LGA170 bending corrector buckle supports for Intel 12 13th generation CPU, motherboard CPU slot for LGA1700 chipset, for H610 B660 Z690 series. 4. Specification: Approx. 54x70x6mm 2.13x2.76x0.24in, all aluminum, 20g for the main body, 55g for the whole body, well designed to fit the CPU and support the weight of the cooler to prevent the CPU from bending, black version. 5. Insulated Feet: Adopt for LOTES original same specification insulated protective feet. Fit pressure, even crimping, multiple installations will not wear the CPU cover, combined with the CPU cooler and fan to get rid of high temperature troubles. 6. Easy Installation: L shaped screwdriver is included for easy installation of LGA1700 BCF on CPU. We recommend watching the video operation for a successful one step installation. Specification: Item Type: LGA170 Bending Corrector Buckle Material: Aluminum Alloy Size: Approx. 54x70x6mm 2.13x2.76x0.24in . Package List: 1 x Bracket 1 x Screwdriver 1 x Silicon Grease 1 x Scraper 1 x Plastic Box Note: Manual measurement please allow some error.